Holostik, a global leader in phygital anti-counterfeiting and packaging solutions, made a resounding impact at the India Food Manufacturing Summit 2025, held on May 30 at The Imperial, New Delhi. Organized by the Trade Promotion Council of India (TPCI) in collaboration with the Authentication Solution Providers’ Association (ASPA), the summit served as a curtain-raiser for the upcoming India Food Manufacturing Trade Show and brought together top industry voices to explore innovations shaping the future of food and beverage manufacturing.
Mr. Ankit Gupta, Joint Managing Director at Holostik and Vice President of ASPA, was a key panelist in the discussion on ‘The Future of Packaging & Labeling.’ Wearing both hats, he spoke passionately about the urgent need to integrate secure and sustainable packaging in the food industry.
Highlighting the growing threat of counterfeiting, Mr. Gupta shared alarming figures from the recent ASPA-CRISIL report, which estimates the food and FMCG sectors to be among the most vulnerable to counterfeiting, posing serious threats to consumer health, brand reputation, and revenue.
Mr. Ankit Gupta with fellow speakers and moderator of the panel discussion on Future of Packaging & Labelling: Smart, Safe & Sustainable Solutions
He further elaborated on how Holostik’s phygital solutions – a fusion of physical security features and digital technologies – are revolutionizing the packaging landscape. “Our phygital solutions bridge the gap between physical products and digital transparency, ensuring authenticity and sustainability,” Mr. Gupta remarked. “Like the old saying goes, ‘Ek Aur Ek Gyarah’, by combining physical security features with digital intelligence, we create a robust defense against counterfeiting.”
Holostik’s solutions – ranging from holographic labels and QR-based authentication to real-time track and trace – empower brands to secure their supply chains, instill consumer trust, and reduce environmental impact through smart design and eco-friendly materials.
The summit witnessed active participation from industry stakeholders, regulators, and solution providers, and fostered meaningful dialogue on the need for secure, traceable, and green packaging in India’s rapidly evolving food ecosystem.
Holostik thanks the organizers, co-panelists, and attendees for their enthusiastic participation and reaffirms its commitment to building a safer, more transparent, and sustainable future for the packaging industry.